Research Paper
V. Ganesan*
Assistant Professor, Department of
Electronics and Telecommunication Engineering, Sathyabama University, Chennai,
India.
Ganesan, V. (2015). A Novel
Implementation of Logic Gates Design Using High Electron Mobility
Transistor. i-manager’s Journal on Circuits and Systems, 3(2),
14-18. https://doi.org/10.26634/jcir.3.2.3410
Abstract
The next generation
of logic gate devices is expected to depend upon radically new technologies
mainly due to the increasing difficulties and limitations of existing MOS
technology. The high electron mobility transistor (HEMT) should ideally be the
best device to work for high performance VLSI circuit design. This paper
enumerates the design of high speed logic gates NOR, NAND, and NOT using
AlGaN/GaN high electron mobility transistor (HEMT). This high electron mobility
transistor is a novel device that is projected to outperform scaled CMOS
technologies. The high electron mobility transistor based devices offers high
mobility, high carrier velocity for fast switching. The p-type or n-type
switching behavior depends upon the polarity gate voltage. The logic gates are
designed by TTL logic, so the power consumption is less in this logic gates. It
can be efficiently used in VLSI ICs. PSPICE simulations have been performed on
the logic gates designed using both these technologies and their output
behaviors have been extensively studied at different supply voltages keeping
the designs at room temperature. The performances are evaluated in terms of
power, delay and PDP to show that it is possible to reduce the delay and power
consumption of the logic gates by replacing the CMOS transistors of the design
with the emerging high electron mobility transistor(HEMT). The simulation
results of the proposed logic gates appear to have better speed of operation.
It can be suitable for SPICE simulation of hybrid digital Ics.
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